A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging

  1. Vallepuga-Espinosa, J.
  2. Ubero-Martínez, I.
  3. Rodríguez-Tembleque, L.
  4. Cifuentes-Rodríguez, J.
Revue:
Engineering Analysis with Boundary Elements

ISSN: 0955-7997

Année de publication: 2020

Volumen: 115

Pages: 28-39

Type: Article

DOI: 10.1016/J.ENGANABOUND.2020.02.011 GOOGLE SCHOLAR
La source de données: Scopus