A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging

  1. Vallepuga-Espinosa, J.
  2. Ubero-Martínez, I.
  3. Rodríguez-Tembleque, L.
  4. Cifuentes-Rodríguez, J.
Aldizkaria:
Engineering Analysis with Boundary Elements

ISSN: 0955-7997

Argitalpen urtea: 2020

Alea: 115

Orrialdeak: 28-39

Mota: Artikulua

DOI: 10.1016/J.ENGANABOUND.2020.02.011 GOOGLE SCHOLAR
Datuen iturria: Scopus